Manufacturing Engineer - Advanced Components

Biotronik

  • Lake Oswego, OR
  • Permanent
  • Full-time
  • 1 month ago
Working for Micro Systems Engineering, Inc. (MSEI) means joining an elite team to work on some of the most exciting challenges in medical technology today. We are a pioneer in developing innovative implantable medical device technologies and devices that save and enhance the quality of life for millions of individuals living with cardiovascular and chronic neurologic pain disorders. With more than 40 years of experience in design and manufacturing of active implantable medical devices, our continuing success is based on our company's core values - innovation, quality, reliability, integrity, teamwork, and undisputed expertise - thus enabling us to inspire confidence and trust in physicians and patients worldwide. We are continually looking for talented engineers, scientists, and professionals to share in our mission.Please join us as:Manufacturing Engineer - Advanced ComponentsWe are expanding our team and seeking a talented Design and Development Engineer to join our innovative Advanced Component Technologies group. In this role, you will be responsible for the development, implementation, and qualification of new supply chain and technology platforms that enable MSEI to meet its product quality, reliability, volume, delivery, and cost objectives.Your Responsibilities
  • Define & deploy technology platforms in a cross-functional team for new product applications through testing, simulation and prototypes.
  • Qualification of components for use in surface mount electronic manufacturing.
  • Use systematic problem-solving approaches to resolve quality/performance issues with suppliers, development, and manufacturing teams.
  • Lead testing and validation of components for high reliability applications, by performing use case based electrical and environmental stress tests.
  • Implementation tasks including leading stage-gate approvals, documentation, supplier quality interface, characterization, verification and on-going sustaining support in a highly automated manufacturing environment.
  • Perform long term road mapping activities to guide solutions to intercept with future product needs
  • Assess, communicate with key stakeholders, and qualify process changes at suppliers
  • Perform on-site supplier audits, domestic and international
Your ProfileEducation / Experience Requirements
  • B.Sc. or M.Sc in Electrical Engineering, Applied Physics, Material Science, or equivalent physical science, with evidence of high academic achievement
  • Excellent written and verbal communications skills; Detail oriented
  • 3+ years experience with chip scale packaging, direct bump attach, copper pillar, and similar technologies
  • Detailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach; their materials and processes.
  • Detailed knowledge of IC packaging failure modes and root cause analysis techniques
  • Experience in high reliability electronics manufacturing environment
  • Experience with quality systems including technical writing of quality-relevant documentation
  • Strong physics-based reasoning
  • Experience with failure analysis and root cause corrective action with suppliers
  • Demonstrated ability to conceive, implement and complete engineering projects and experiments on schedule
  • Proficiency in standard office productivity software (Excel, Word, PowerPoint, etc... )
  • Demonstrated ability to interface across multiple functions/organizations (Quality, Manufacturing, Supply Chain, Test, Module/System development) to drive closure on projects.
  • Demonstrated creativity with multiple examples of innovative solutions. U.S. or EU Patents desirable.
Physical & Travel RequirementsThe physical demands described within this job description are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
  • While performing the duties of this job, the employee is regularly required to be independently mobile.
  • The employee is also required to interact with a computer for extended periods of time and communicate with co-workers.
  • Must be able to work a minimum of 40 hours / week.
  • Must be able to travel internationally and domestically, less than 5% of the time.
Location: Lake Oswego(0001)Working hours: Full-timeMSEI Lake Oswego Oregon (US-OR) USAJob ID: 60903Micro Systems Engineering, Inc. is an equal opportunity employer. In accordance with applicable law, the company prohibits discrimination based on race, color, religion, creed, gender, pregnancy or related medical conditions, age, national origin or ancestry, physical or mental disability, sexual orientation, genetic information, uniformed service or any other consideration protected by federal state and local laws. Our commitment to equal opportunity employment applies to all persons involved in our operations and prohibits unlawful discrimination by any employee.

Biotronik