Identify, diagnose and resolve assembly process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Support SPC/FDC/RMS/APC Support site to site portability Manage / audit material suppliers to achieve quality, cost and risk management objectives Support internal and external audits Ability to manage projects to ensure deliverables are completed on time and on budget. Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Ability to resolve complex issues through root-cause or model-based problem solving. Bachelors of Science + 6yrs experience or Masters of Science. + 3yr experience or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields or proven experience Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions.
