
Assembler 2 - 3rd Shift
- Nashua, NH
- Permanent
- Full-time
- Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
- Operate and set-up manual Gold wire bonders, manual eutectic/epoxy die attach systems or SMT equipment per documented work instructions.
- Involves working to microcircuit layout drawings; Operator is responsible for proper wire formation, bond appearance and bond strength per Mil Std 883.
- Operator is responsible for proper die attachment, including coverage and die shear strength per Mil Std 883.
- Operator is responsible for proper soldering of components - both manual and automatic per IPC-610 standards.
- Flexibility to be trained in multiple Microelectronics processes that involve other assembly activities.
- Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.
- Ability to set-up, operate and adjust or ability to learn to run a variety of microelectronic production equipment.
- Minimum of 2 years' experience in microelectronics module assembly area.
- High School diploma required.
- Wire-bonding gold wire or ribbon to a variety of die and substrates.
- Die attach using solder preforms or epoxy to a variety of components.
- SMT using Mydata pick and place equipment.
- Operate following all area ESD protocols.
- Physical Environment and Working Conditions: Clean-room environment with smocks, masks and gloves.