Failure Analysis Engineer
Qorvo
- Richardson, TX
- Permanent
- Full-time
- Work with process/integration engineers to develop new III-V technologies with focus on failure analysis and defect characterization through various metrology, automatic optical inspection (AOI) tools, and material characterization tools.
- Implement FIB/SEM techniques to locate failure sites on GaN/GaAs wafers
- Characterize device (composition, layer thickness, edge profile and layer coverage) for process control, development, and improvement.
- Identify failure mechanisms responsible for device performance degradation.
- Determine techniques been suited to obtain desired results for each defected part.
- Consult with process development engineer and integration engineer to develop test plans and techniques to optimize capabilities and disseminate results as efficiently as possible.
- Design optimal procedure for modification of GaAs/GaN devices using FIB edit to provide best performance of parts used for electrical confirmation of design changes.
- Develop new procedures to optimize results for new and unique samples/processes.
- Off shift working schedule for FIB/SEM analysis (3am-11am, or 3pm-11pm)
- MS or PhD in Material science, or Physics with 5+ years of experience in semiconductor industry
- Proficient in using SEM/FIB tool and other AOI tools.
- Organized approach to problem solving
- Failure analysis and yield enhancement skills are required
- Experience with Compound Semiconductor ICs, semiconductor physics and/or processing, understanding of GaN, GaAs, pHEMT, transistors are preferred
- Strong teamwork and communication skills are required